Kamis, 18 Desember 2014

OIC tambah 15 anggota baru, termasuk HP, Lenovo, Siemens dan GE


Hari ini, Open Interconnect Consortium (OIC) memperkenalkan 15 perusahaan sebagai anggota terbarunya. GE Software, anggota terbaru untuk kategori diamond, juga akan bergabung dengan dewan direksi. Perusahaan-perusahaan ini mewakili berbagai bidang dan keahlian penting untuk misi organisasi. Produk dan layanan mereka berkisar dari desain backend untuk produk konsumen di pasar seperti komputasi, keamanan, pengujian dan konektivitas nirkabel.

"Kenaikan sepertiga dalam keanggotaan yang luar biasa ini dicapai hanya dalam beberapa minggu sejak pengumuman terakhir kami yang menggarisbawahi pentingnya teknologi dimana kami bertujuan untuk membawanya ke pasar," kata Jong-Deok Choi (JD Choi), wakil presiden eksekutif dan wakil kepala Software R&D Center, Samsung Electronics dan presiden OIC. "Partisipasi mereka akan membantu kita untuk memastikan kolaborasi kami termasuk masukan dari pemain kunci yang mewakili pasar yang luas dari Internet of Things."

Perusahaan-perusahaan baru yang terdaftar dalam keanggotaan OIC meliputi:
  1. ADT
  2. Cable Television Laboratories, Inc.
  3. Cadence Design Systems
  4. DT&C Co., Ltd.
  5. GE Software
  6. Electronics and Telecommunications Research Institute (ETRI)
  7. Enea Netbricks SAS
  8. EXO U Inc.
  9. HP
  10. Lab IX – A Flextronics Company
  11. Lenovo
  12. Real-Time Innovations, Inc.
  13. Siemens AG
  14. WigWag Inc.
  15. Works Systems, Inc.



Mission to establish interoperability across the Internet of Things gains new, diversified supporters including GE Software, HP and Siemens

PORTLAND, Ore., December 17, 2014—Today, the Open Interconnect Consortium, Inc. (OIC) introduced 15 companies as its newest members. GE Software, its newest diamond member, will also join its board of directors. These companies represent various fields and expertise crucial to the organization’s mission. Their products and services range from backend design to consumer products in markets such as computing, security, testing and wireless connectivity.

“The remarkable one-third increase in membership achieved in just weeks since our last announcement underscores the importance of the technology we aim to bring to market,” said Jong-Deok Choi, executive vice president and deputy head of Software R&D Center, Samsung Electronics and OIC president. “Their participation will help us to ensure our collaboration includes input from key players representing the Internet of Things market breadth.”

The companies new to OIC’s membership roster include:
  • ADT
  • Cable Television Laboratories, Inc.
  • Cadence Design Systems
  • DT&C Co., Ltd.
  • GE Software
  • Electronics and Telecommunications Research Institute (ETRI)
  • Enea Netbricks SAS
  • EXO U Inc.
  • HP
  • Lab IX – A Flextronics Company
  • Lenovo
  • Real-Time Innovations, Inc.
  • Siemens AG
  • WigWag Inc.
  • Works Systems, Inc.

For additional information on membership benefits and how to join the OIC, visit www.openinterconnect.org/join.

About Open Interconnect Consortium

The Open Interconnect Consortium, a Delaware non-profit corporation, is being founded by leading technology companies with the goal of defining the connectivity requirements and ensuring interoperability of the billions of devices that will make up the emerging Internet of Things (IoT). To learn more, visit www.openinterconnect.org or email info@openinterconnect.org.



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